![Sensors | Free Full-Text | Design and Modeling of a MEMS Dual-Backplate Capacitive Microphone with Spring-Supported Diaphragm for Mobile Device Applications Sensors | Free Full-Text | Design and Modeling of a MEMS Dual-Backplate Capacitive Microphone with Spring-Supported Diaphragm for Mobile Device Applications](https://pub.mdpi-res.com/sensors/sensors-18-03545/article_deploy/html/images/sensors-18-03545-g001.png?1570600007)
Sensors | Free Full-Text | Design and Modeling of a MEMS Dual-Backplate Capacitive Microphone with Spring-Supported Diaphragm for Mobile Device Applications
![TPI Elektronische Bauteile :: Produkte :: Akustik :: Mikrofone :: SMD Type MEMS Microphon Electronics Mechanical System TPI Elektronische Bauteile :: Produkte :: Akustik :: Mikrofone :: SMD Type MEMS Microphon Electronics Mechanical System](https://www.tpi-electronic.de/media/pages/produkte/akustik/mikrofone/smd-type-mems-microphon-electronics-mechanical-system/0cbb464829-1525683558/mems-1.jpg)
TPI Elektronische Bauteile :: Produkte :: Akustik :: Mikrofone :: SMD Type MEMS Microphon Electronics Mechanical System
![ICS-40730 : Detaillierte Informationen | Keramische Schalt- / Heizelemente und Piezo-Komponenten, Schütze, Signaltongeber und Mikrofon - MEMS-Mikrofone (Mikrofon) | TDK Product Center ICS-40730 : Detaillierte Informationen | Keramische Schalt- / Heizelemente und Piezo-Komponenten, Schütze, Signaltongeber und Mikrofon - MEMS-Mikrofone (Mikrofon) | TDK Product Center](https://product.tdk.com/system/files/dam/img/product/sw_piezo/mic/mems-mic/080201_ics-40730_pi0401.png)